Austin Hennecke, freshman, Dean’s List, College of Arts and Sciences, film studies.Some international students are listed under their adopted hometowns in the United States. The first section is for students from Nebraska, the second is for students from elsewhere in the United States, the third is for international students, and the fourth is for students who chose not to have their hometowns listed. Hixson-Lied College of Fine and Performing Arts, 3.7 Interim Dean Christopher Marks.Įxplore Center for undeclared, pre-engineering, pre-health and pre-law students, 3.6 Senior Associate Vice Chancellor and Dean of Undergraduate Education Amy Goodburn.įollowing is a list of honorees by hometown, state and country. Students can be on the Deans’ List for more than one college.Ĭollege of Agricultural Sciences and Natural Resources, 3.75 Dean Tiffany Heng-Moss.Ĭollege of Architecture, 3.75 Interim Dean Sharon Kuska.Ĭollege of Arts and Sciences, 3.7 Dean Mark E. Button.Ĭollege of Business, 3.6 Dean Kathy Farrell.Ĭollege of Education and Human Sciences, 3.75 Dean Sherri Jones.Ĭollege of Engineering, 3.5 Dean Lance C. Pérez.Ĭollege of Journalism and Mass Communications, 3.7 Dean Shari Veil. All qualifying grade-point averages are based on a four-point scale and a minimum number of graded semester hours. Listed below are the minimum requirements for each entity and the name of its respective dean or director. Qualification for the Deans’ List varies among the eight undergraduate colleges and the Explore Center. Such hybrid Cu–Cu microbumps with high bonding strength and low thermal budget can be widely used for advanced ultra-fine-pitch packaging.More than 6,200 University of Nebraska–Lincoln students have been named to the Deans’ List for the spring semester of the 2021-22 academic year. ![]() ![]() The fracture modes of the hybrid bonding structure were characterized using pull tests and correlated with their bonding properties. The bonding interfaces were partially removed and the joints were further strengthened. We found that under a post-annealing treatment, recrystallization and grain growth occurred. A non-flow underfilling process was performed, and low temperature bonding was achieved in a single heat treatment at 180 ☌ for 120 min without vacuum. We tailored and correlated the fracture modes, bonding strengths, and microstructures of the joints. Such hybrid Cu–Cu microbumps with high bonding strength and low thermal budget can be widely used for advanced ultra-fine-pitch packaging.ĪB - Highly (111)-oriented nanotwinned copper (nt-Cu) and non-conductive paste (NCP) were employed to fabricate hybrid Cu–Cu bonding. ![]() N2 - Highly (111)-oriented nanotwinned copper (nt-Cu) and non-conductive paste (NCP) were employed to fabricate hybrid Cu–Cu bonding. T1 - Hybrid Cu-to-Cu bonding with nano-twinned Cu and non-conductive paste
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